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July 16, 2026 07:10
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Up to standards ✅🟢 Issues
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| Metric | Results |
|---|---|
| Complexity | 0 |
| Duplication | 0 |
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Codecov Report✅ All modified and coverable lines are covered by tests. Additional details and impacted files@@ Coverage Diff @@
## main #2944 +/- ##
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Coverage 93.89% 93.89%
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Files 175 175
Lines 15515 15515
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Hits 14568 14568
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July 16, 2026 10:01
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The documentation for this pull request will be available at https://geometry.docs.pyansys.com/pull/2944. Please allow some time for the documentation to be deployed. |
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Description
Replaces the manual copy+translate+subtract nested loop in the BGA solder ball example with
create_fill_pattern, which stamps the entire 3×3 infill hole array in a single API call.Source model changes:
PITCH = 1.0andSOLDER_RADIUS = 0.25constants; remove pre-sketched seed bodies at origincreate_fill_pattern(FillPatternType.GRID, margin=PITCH/2, x_spacing=PITCH, y_spacing=PITCH)— 27 individual subtract operations → 1 callextrude_sketchcalls (nocopy/translate)Target model: unchanged —
create_fill_patterntargets concave features in a flat host face; the revolve-based solder balls are convex and not applicable.Issue linked
Follow-up to #2939.
Checklist
feat: extrude circle to cylinder)