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Resolve CSV-observed DIP geometry independently from physical package width. Use compatible native Fritzing parts, validated LibrePCB device metadata, or explicit remembered package choices for safe multi-board placement. Bundle curated W65C02 data and add regression coverage.
cdrogers
marked this pull request as draft
August 18, 2026 03:39
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cdrogers
marked this pull request as ready for review
August 18, 2026 03:50
cdrogers
marked this pull request as draft
August 18, 2026 03:53
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Summary
This adds a breadboard wiring CSV import workflow with source preview, configurable column mapping, validation, DIP component resolution, and placement.
Screenshots
Import and mapping
Validation and placement
Validation performed
Current scope
The placement workflow currently targets three RSR 03MB102 breadboards and supported 300 mil/600 mil DIP layouts. The mapping and parsing layer is designed to accept differing CSV column orders and supported delimiters rather than requiring one fixed source format.