Skip to content

Add SGM2036 UTDFN-4-EP footprint with diamond thermal pad - #879

Open
ikoomm wants to merge 1 commit into
tscircuit:mainfrom
ikoomm:feat/utdfn-4-sgm2036
Open

ikoomm wants to merge 1 commit into
tscircuit:mainfrom
ikoomm:feat/utdfn-4-sgm2036

Conversation

@ikoomm

@ikoomm ikoomm commented Sep 9, 2026

Copy link
Copy Markdown

Implements #183 for SGM2036-1.2YUDH4G/TR, one of the actual parts in the issue's linked UTDFN-4-EP(1x1) catalog list.

Adds utdfn4, the catalog spelling UTDFN-4-EP(1x1), and the typed fp().utdfn() builder. Geometry follows SGMICRO's TX00066.000 recommended land pattern: 0.48mm square thermal pad rotated 45°, three chamfered corner pads, and the distinct extended pin 1 at lower left in the top view. Includes refdes, courtyard, a pin-1 silkscreen marker, and optional exposed-pad omission.

Reference: SGM2036 datasheet, PDF pages 5 (pinout) and 19 (land pattern). This implements that specific land pattern; the README explains that another manufacturer's 1x1mm package may differ.

Validation: eight new tests plus existing DFN/corner-pad/WSON coverage: 15 passed, 79 assertions. Checks pad bounds, pin numbering, diamond side length, at least 0.2mm signal-to-thermal clearance, aliases, modifiers and unsupported pin counts. Seven new cases fail on original main because utdfn is unsupported. Two SVG snapshots included and the default render visually checked against the drawing. ESM/declaration build and formatting pass.

GitHub CI also passes all four checks on f2075885c3dfa53f11218f26c8754362faa68421: 572 tests passed, 0 failed, build, format check and format workflow. Test run.

The issue mentions a possible $10 bounty. Please confirm eligibility if this contribution is accepted.

Sign up for free to join this conversation on GitHub. Already have an account? Sign in to comment

Labels

None yet

Projects

None yet

Development

Successfully merging this pull request may close these issues.

1 participant