chiplets

Source code for Multifidielity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures

An Open Source Link Protocol and Controller

A Robust Thermal Simulator for Heterogeneous Integration Platforms

TIO controller which is running on every cluster node.

FrugalAI Chip: Modular silicon architecture for disposable AI. Achieves 10.9× better CAPEX efficiency using 28nm chiplets + algorithmic decomposition. Validated: +4.8% accuracy, -91% carbon, 21.47× transformer speedup.

Reproducible microbenchmark for modeling domain crossing energy in heterogeneous compute systems.

Eliyan Corporation is a fabless semiconductor company in Santa Clara, California that develops chiplet and chip-to-chip interconnect physical-layer (PHY) IP for multi-die and AI infrastructure systems.

PseudolithIC is a semiconductor company specializing in heterogeneous integration technology for cost-effective, high-performance silicon RFICs (radio frequency integrated circuits).

Baya Systems is a semiconductor IP company accelerating intelligent compute with chiplets. Backed by Matrix Partners and Intel Capital and based in Santa Clara, California (with offices in Austin, Texas and Bengaluru, India), Baya provides the WeaverPro software platform and the WeaveIP unified fabric and cache IP portfolio.

Amkor Technology is the world's largest US-based provider of outsourced semiconductor packaging and test services (OSAT), serving integrated device manufacturers, fabless semiconductor companies, and contract foundries.

Kandou (Kandou AI) is a fabless semiconductor company founded in 2011 by Amin Shokrollahi and headquartered in Lausanne, Switzerland. It designs high-speed, energy-efficient chip-to-chip interconnect technology built on its proprietary Copper MIMO / Chord Signaling architecture, which turns noise in copper channels into usable bandwidth for…